MediaTek Dimensity 1050, Dimensity 930, Filogic 880/380 WiFi 7 platforms, and Helio G99 now official!

MediaTek just launched the 6nm Dimensity 1050, Dimensity 390, and Helio G99 6nm SoC. There's the new Filogic 880 and 380 WiFi 7 platforms as well!

MediaTek announces a myriad of new chips!

MediaTek Dimensity 1050, Dimensity 930, Helio G99

First up, we have the MediaTek Dimensity 1050 mmWave 5G octa-core processor. It uses the 6nm TSMC process and features 4x Cortex-A78 CPUs at 2.5GHz and 4x Cortex-A55 CPUs at 2GHz. It also has the Mali-G610 MC3 GPU.

It supports up to LPDDR5 RAM and UFS 3.1 storage. In terms of camera technology, it can support 20MP+20MP configuration, 108MP main sensor, and Dual HDR video capture hardware 3x HDR-ISP MFNR 3DNR AINR Hardware Depth Engine Warping Engine.

In terms of connectivity, it sub-6GHz mmWave 5G connectivity, SA/NSA modes, Bluetooth 5.2, and WiFi 6.

The MediaTek Dimensity 930 5G octa-core processor also uses the 6nm TSMC process. It has 2x Cortex-A78 CPUs at 2.2GHz and 6x Cortex-A55 CPUs at 2GHz. It also has the IMG BXM-8-256 GPU.

It supports up to LPDDR5 RAM and UFS 3.1 storage. In terms of camera technology, it can support 64MP, 108MP, Hardware video HDR, 3x HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, and Warping Engine.

In terms of connectivity, it has True Dual 5G SA connectivity, SA Option2, NSA Option3, WiFi 6, and Bluetooth 5.2.

MediaTek Helio G99 is another 6nm TSMC SoC with 2x Cortex-A76 cores at 2.2GHz and 6x Cortex-A55 2 cores at 2GHz. It also has the Mali-G57 MC2 GPU. It also has support for LPDDR4X RAM and eMMC 5.1/UFS 2.2 storage.

For cameras, it supports 16MP + 16MP, 108MP, AI Face Detection; HW depth engine; AINR, Hardware Warping Engine (EIS), Rolling Shutter Compensation (RSC) engine, MEMA 3DNR, and Multi-Frame Noise reduction.

It only has 4G LTE, dual-band WiFi 5, and Bluetooth 5.2.

MediaTek Filogic 880 and Filogic 380 WiFi 7 platforms

MediaTek Filogic WiFi 7 platforms

The Filogic 880 and Filogic 380 WiFi 7 platform solutions from MediaTek are designed for high-bandwidth operation, retail, and enterprise applications, including consumer electronics. These chips will be among the first WiFi 7 solutions available, allowing device makers to use cutting-edge gadgets with cutting-edge networking capabilities.

The Filogic 880 is a 6nm SoC that provides a stable basis for optimal WiFi and Ethernet performance.  A WiFi 7 access point, a smart application processor, and a network processing unit make up this platform.

The Filogic 380, on the other hand, is a 6nm chip designed to provide WiFi 7 and Bluetooth 5.3 connectivity to consumer electronics such as smartphones, tablets, TVs, laptops, set-top boxes, and OTT streaming sticks.

What do you guys think?

Source: MediaTek