Realme 3 is set to be unveiled on March 04 and will be powered with the Helio P70 as confirmed by the brand's CEO Madhav Sheth.
 |
Realme 3 to feature a diamond cut design? |
Realme's CEO Madhav Sheth confirmed that the Realme 3 will have the Helio P70 in India. We are yet to confirm if the Realme 3 in the Philippines will have the similar chipset. The upcoming Realme 3 is the company's second smartphone to be equipped with MediaTek SoC following the Realme U1.
 |
Helio P70 vs Snapdragon 660 |
It is said to be 30 percent faster, to have 3 percent better CPU performance, and 40 percent lower power consumption in heavy loading games.
The Realme 3 is also being expected to have a 48MP main camera. Different from what Realme has teased on their Twitter account, this leaked image of the upcoming smartphone shows a starry pattern on the back design instead of a diamond design.
 |
Starry back design? |
These teasers are yet to be confirmed and we have to watch out on these things until March 04, 2019.
What do you guys think?
Post a Comment