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MediaTek outs 6nm Dimensity 1200 5G SoC with up to 200MP camera support, reveals Dimensity 1100 5G as well

World's largest smartphone chipset vendor MediaTek today launched two new premium 5G chipsets called Dimensity 1200 and 1100.
MediaTek outs 6nm Dimensity 1200 5G SoC with up to 200MP camera support, reveals Dimensity 1100 5G as well
6nm Dimensity 1200 Premium 5G SoC

Key features of MediaTek Dimensity 1200 and 1100 5G chipsets

These two chips were built using the new 6nm manufacturing process and are designed to deliver powerful AI, graphics, camera, multimedia, and connectivity features.
Dimensity 1200 details
Dimensity 1200 details

Dimensity 1200 boasts an octa-core design featuring ARM's Cortex-A78 Ultra Core clocked at 3GHz. It is paired with 3x 2.6GHz Cortex-A78 Super Cores and 4x 2.0GHz Cortex-A55 Efficiency Cores. It also has a Mali-G77 nine-core GPU, six-core MediaTek APU 3.0, and UFS 3.1 support.

On the other hand, Dimensity 1100 also has an octa-core design based on the 6nm process. It boasts 4x Cortex-A78 super cores at 2.6GHz and 4x Cortex-A55 efficiency cores. It also goes with ARM's Mali-G77 GPU.

For 5G, the two are equipped with a highly integrated 5G modem with MediaTek's 5G UltraSave technology for better power efficiency. The modem supports both 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR).

MediaTek also highlighted that the modem has 5G HSR Mode and 5G Elevator Mode enhancements to ensure a seamless and reliable 5G connection across networks as well as TÜV Rheinland certification for its 5G performance which covered 72 real-world scenarios to ensure high-quality 5G experiences across a wide variety of scenarios.

For the display, Dimensity 1200 supports ultra-fast 168Hz refresh rates while Dimensity 1100 has up to 144Hz.

Both chipsets support MediaTek’s HyperEngine 3.0 gaming technologies, which includes 5G call and data concurrency for more reliable connectivity along with multi-touch boost touchscreen responsiveness.

The Taiwanese tech giant also noted that the new chips support ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.

For cameras, Dimensity 1200 uses a five-core HDR-ISP which supports up to 200MP photos and 4K HDR videos. Dimensity 1100 supports up to 108MP cameras.

The two have AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR), and HDR capabilities as well as AI-enhanced video playback features including AI SDR-to-HDR.

MediaTek's APU 3.0 tech has an enhanced multi-task scheduler that reduces latency and improves power-efficiency.

The new chips both support the company's Dual-Link True Wireless Stereo Audio with Bluetooth 5.2 support to let users stream to multiple wireless devices simultaneously. The chipsets also have ultra-low latency true wireless stereo audio and LC3 encoding for higher quality, lower latency streaming audio with better power efficiency to prolong the battery life of wireless earphones.

OEMs like Xiaomi, vivo, OPPO, and realme expressed their support for the new Dimensity chips. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and the beginning of Q2 this year.

MediaTek said that other collaborators and supporters of the new MediaTek 5G chipsets include ARM, China Mobile, Tetras.AI, ArcSoft, and Tencent Games.

MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier, said JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business Unit. Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements.

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