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Sony and TSMC to invest USD 4.7B to build advanced smartphone image sensors in Japan

TECNO
Infinix
Sony Group and Taiwan's TSMC will invest USD 4.7 billion (around 287.83 billion) to build advanced smartphone image sensors, with production set for 2029.
File photo: Sony and TSMC logos

Sony x TSMC

Sony will contribute JYP 465B (USD 2.9B) and TSMC JYP 282B (USD 1.8B) to the joint venture in Koshi City, Kumamoto, using Sony's semiconductor plant as the hub.


The companies said that the venture merges TSMC's advanced process technology with Sony's sensor expertise, targeting applications from smartphones to AI robotics.
File photo: Sony LYTIA sensor
File photo: Sony LYTIA sensor

Sony will spearhead core sensor development, product planning, and design, while TSMC provides cutting‑edge manufacturing know‑how.

Production will begin in 2029.

Sony currently holds over 50% of the global image sensor market by value.

TSMC is already ramping up in Japan, with a 3nm chip plant in Kumamoto announced earlier this year to strengthen supply resilience.

Will this accelerate the development of mobile imaging sensors even further?

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