Key specs of the 5nm Qualcomm Snapdragon 875 leaks

91mobiles has just received alleged leak info about Qualcomm's upcoming flagship processor, the Snapdragon 875.

Qualcomm's logo

Future killer flagship mobile chip!

According to the report, the said chip will be the company's very first SoC built under the 5nm manufacturing process for better performance and lower power consumption.

The chipset will come with the SM8350 codename. It'll be using ARM's v8 Cortex tech on its Kryo 685 CPU. It'll be paired with the Adreno 660 GPU, Adreno 665 VPU, Adreno 1095 DPU, and the new X60 5G multi-mode modem with support for mmWave and sub-6GHz bands.

The SoC is said to come with Qualcomm Secure Processing Unit (SPU250), Spectra 580 image-processing engine, Snapdragon Sensors Core Technology, External 802.11ax, 2x2 MIMO, Bluetooth Milan, Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator, Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM, and Low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.

Qualcomm is expected to make the chip official in its annual Tech Summit in Hawaii every December. The Snapdragon 875 chipset could power most of the flagship Android smartphones of 2021.

Could this be the SoC solution to beat Samsung's upcoming chip in partnership with AMD?

Let's see!

Source: 91mobiles