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MediaTek releases Dimensity 1300, 8000, and 8100 5G-ready premium chipsets

OPPO
Huawei
The world's largest mobile chipmaker MediaTek has just launched 3 new chips design for premium Android smartphones.
8000 and 8100

New premium chips from the number 1 mobile chipmaker in the world!

Dimensity 1300
Dimensity 1300

First is the Dimensity 1300, an upgrade of the capable Dimensity 1200. It is a 6 nm-based chip boasting 1x Cortex-A78 ultra-core clocked at 3.0GHz, 3x Cortex-A78 super cores, and 4x Cortex-A55 efficiency cores. It also has ARM's Mali-G77 MC9 GPU, and MediaTek APU 3.0 with a 10 percent improvement in AI tasks.

MediaTek also claimed that it has new AI enhancements to improve HDR capabilities and night shot photography.

But now, it has the HDR-ISP with support of up to 200MP cameras, MediaTek HyperEngine 5.0 to further optimize AI-VRS, WiFi/Bluetooth Hybrid 2.0, and Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio wireless buds latency improvements.
Dimensity 8000 series architecture
Dimensity 8000 series architecture

Next, is the Dimensity 8000 fabbed under the 5nm manufacturing process by TSMC. It uses 4x Cortex-A78 cores at 2.75GHz and 4x Cortex-A55 cores at 2.0GHz. It is paired with the Mali-G610 MC6 GPU.

Meanwhile, the Dimensity 8100 is a bit more powerful as it is using higher-clocked Cortex-A78 cores at 2.85GHz and 20 percent more GPU frequency over the Dimensity 8000.

Both of the new 8000 series Dimensity chips come with MediaTek's HyperEngine 5.0 gaming technologies with frame rates of 170fps for DImensity 8100 and 140fps for DImensity 8000.

The two chips also bring Dimensity 9000's Imagiq 780 photo and video capture engine, 5th generation AI processor, and Release-16 5G modem.

Both support quad-channel LPDDR5 6400Mbps, dual-channel UFS 3.1, 200MP camera with dual camera HDR recording, up to 168Hz at FHD+ resolution screen, up to 120Hz at WQHD+ resolution screen, WiFi 6E, Bluetooth 5.3, and plenty of GPS bands.

Both are under the Dimensity Low Power Architecture.

According to the company, the new chips will roll out this first quarter of 2022. Some of the upcoming phones confirmed to use the Dimensity 8000 series chips are the Redmi K50 series, realme GT Neo3, OPPO K10, and an unspecified OnePlus smartphone.

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