Xiaomi Mix Flip key details confirmed: SD8G3, 3D vapor chamber, 4,780mAh battery, Leica Cameras
Xiaomi teases its upcoming clamp-shell-type foldable by confirming key specs like Leica Cameras, Snapdragon 8 Gen 3 SoC and 3D vapour chamber cooling.
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| Xiaomi Mix Flip teaser |
Will it go global?
Ahead of Xiaomi's Lei Jun event on July 19, the brand has posted official marketing materials on Weibo. These marketing materials include renders of the upcoming flip foldable along with the specifications mentioned earlier, including a 4-inch cover screen with 1,240 resolution and 1,600 nits. The cover screen has two cut-outs for the cameras. Not much was said about the cameras aside from them being co-engineered with Leica and that they will be SUMMILUX high aperture lenses.
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| Xiaomi Mix Flip's internals and HyperOS |
Inside the flip are a 4nm Qualcomm Snapdragon 8 Gen 3 octa-core processor with a 3D vapor chamber, LPDDR5X RAM, UFS 4.0 storage, and a large 4,780mAh battery. The only other phone with the same battery capacity is the HONOR Magic V Flip.
GizmoChina claims that previous reports have claimed that the Mix Flip will have 12GB/16GB RAM, up to 1TB of storage, 67W fast wired charging and an Android 14-based HyperOS operating system.
From the official renders the microphones, IR blaster, USB-C and speaker grills could be seen.
We recommend taking this information with a grain of salt until tomorrow's official announcement.
Stay tuned.
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