MediaTek's 3nm-fabbed chips will be available in the second half of 2024
3nm MTK chips are coming!
It also offers as much as 18 percent speed improvement at the same power or 32 percent power reduction at the same speed and an approximately 60 percent increase in logic density versus TSMC's N5 process.
We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways, said Joe Chen, President of MediaTek. TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.
This collaboration between MediaTek and TSMC on MediaTek's Dimensity SoC means the power of industry's most advanced semiconductor process technology can be as accessible as the smartphone in your pocket, said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.
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