MediaTek reveals key features of Dimensity 7300 and 7300X
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| The two new Dimensity 7300 series SoCs |
Check out the highlights of Dimensity 7300 and 7300X
The chipmaker claimed that these chips are intended for a high-end market that offers next-gen performance providing smartphones with seamless multitasking, exceptional battery life, and displays.
Here is the list of main highlights of these chips as per MediaTek:
Exceptional Battery Life: This ultra-efficient 4nm technology provides among the best power efficiency, extending battery life for the demanding apps of its users.
Transcendent Image Quality: The Imagiq 950 12-bit HDR-ISP is capable of supporting up to 200MP resolution for a phone's main shooter with precise noise reduction, face identification, and video HDR for clear shots in any lighting conditions. The image sensor will have up to 1.3x faster live focus and 1.5x faster photo remastering compared to prior generations. Additionally, it captures 4K HDR video with 50 percent more dynamic range than its rivals.
Incredible Displays: MediaTek's MiraVision 955 feature allows WFHD+ resolution on displays with 10-bit true color. This provides smartphones with a billion colors while also significantly upgrading HDR Media playback and streaming.
Designed for Flip Phones: The MediaTek 7300X can also support displays, making it suitable for foldable phone designs.
Accelerated Gaming: The chipmaker says that its MTK HyperEngine is comprised of an 8-core CPU with Cortex A78 processor and ARM Mali-G615 GPU which provides up to 20 percent higher FPS and more efficient power draw if compared to its competitors. Moreover, they also have major studio support and the expanding gaming ecosystem contributes to the power and performance enhancements of VRS.
Advanced Connectivity: The firm added it also has the chip has Bluetooth 5.4 support, tri-band Wi-Fi 6E, and MediaTek Lightning Connect, which speeds up Bluetooth connection times. Based on face proximity, holding posture, and device orientation, MediaTek UAC 2.0 maximizes antenna performance.
Enhanced AI Computing: The MediaTek NPU 655 provides twice the AI task efficiency over its predecessor, while also supporting new mixed-precision data types for improved images, power efficiency, and performance.
5G R16 Modem: MediaTek says they also feature up to 3.27Gb/s has been achieved in cellular downlink rates, and new 3CC carrier aggregation offers better average speeds and a wider coverage area. In typical 5G usage settings, MediaTek 5G UltraSave 3.0+ offers 13–30 percent more power efficiency than competing options.
Dual VoNR Smartphones: These chips have support for dual 5G SIM with dual VoNR which provides users clear voice and video image qualities.
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