Xiaomi unveils XRING O3: world’s first 3nm mobile processor supporting next-gen LPDDR6 memory

Xiaomi introduced its new XRING 03, the world’s first 3nm chip to support LPDDR6 Memory.

Xiaomi XRING O3 launches

The chip will debut in Xiaomi’s next foldable!

Its introduction at the Xiaomi XRING Chip Technology Communications Conference signals that the Chinese company intends to compete at the highest level of chip design. The brand also said that the chip will debut on the Xiaomi 18 Fold.

Xiaomi XRING O3 to debut on the upcoming Xiaomi 18 Fold next month

It is built on a die size of 133 mm²; the XRING O3 houses over 24 billion transistors, a 26 percent increase in transistor density compared to its predecessor, the XRING O2.

The standout technical achievement of the XRING O3 is its memory interface integration. As the first mobile chipset configured for the next-generation LPDDR6 memory. It achieves a data transfer speed of up to 10,667 Mbps and delivers a total memory bandwidth of 113.8 GB/s (a 48 percent increase over the first-generation XRING O1). Coupled with an internal architecture overhaul that reduces latency to just 82ns, the chipset is designed to eliminate processing bottlenecks in heavy multitasking and high-frame-rate gaming. 

Xiaomi has placed on-device artificial intelligence at the center of the XRING O3 design. Overall AI performance has been boosted by 45 percent, engineered specifically to power Xiaomi's native MiMo on-device AI models.

To achieve this, the SoC incorporates 2 dedicated CPU AI acceleration units and 8 Neural-Network GPU Accelerators with Peak AI Performance Metrics that deliver up to 200 TPOS (Tensor Performance per Second) and 3.13 TFLOPS of vector performance.

Xiaomi also introduced the XRING O100 and XRING D100 chips

Xiaomi also introduced the enterprise-grade AI accelerator XRING O100 and the 3nm high-compute XRING D100 AI chip for driving and autonomous vehicle systems.

Xiaomi XRING O3 key specs and highlights

• TSMC 3nm process node
• 24+ billion transistors
• 133mm² Die Size
• LPDDR6 Memory support
• 82ns latency
• 200 TPOS (Tensor)/ 3.13 TFLOPS (Vector) On-device AI capabilities

The XRING O3 is expected to debut with the Xiaomi 18 Fold next month.

What do you guys think?

Source: YouTube, Via: GSMArena, GizmoChina