TSMC to bring 3nm mobile chips in 2023, 2nm chips in 2025

TSMC just announced its chip development roadmap during the brand's 2022 Technology Symposium. It will be bringing 3nm and 2nm chips in 2023 and 2025.

Here is TSMC's development roadmap for mobile chips!

TSMC announces plans to release 3nm and 2nm starting in 2023!

TSMC's N2 2nm chips will be even more efficient than its 3nm nodes

In the later parts of 2022, TSMC will introduce 3nm processors. In addition, by 2025, it will bring 2nm technology to the mobile market. The 3nm node chip will be grouped into 5 tiers. Each with increased power, transistor density, and efficiency. It starts with N3 and then goes up to N3E (Enhanced), N3P (Performance Enhanced), N3S (Density Enhanced), and N3X (Extreme Density Enhanced) (Ultra High Performance).

In comparison to the N3E node, the 2nm node will improve performance by 10 percent to 15 percent at the same power draw, while lowering consumption by 25 percent to 30 percent at the same frequency and transistor count. N2's chip density is increased by 1.1x as well over N3E.

TSMC also showcased its latest  3DFabric 3D Silicon Stacking Solutions. This includes the world's first SoIC-based CPU employing Chip-on-Wafer (CoW) technology to stack SRAM as a Level 3 cache and an intelligence processing unit stacked on top of a deep trench capacitor die using Wafer-on-Wafer technology.

What do you guys think?

Source: TSMC