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MediaTek launches Dimensity 9300+ chip: Higher clock speed, better AI, anti-AMOLED-burn-in tech

Taiwanese chip giant MediaTek has just launched the Dimensity 9300+. It is the company's newest top-of-the-line SoC superseding the Dimensity 9300.
Dimensity 9300+

Meet MediaTek's flagship chip of 2024

The processor was fabbed on the 3rd generation TSMC 4nm chip production featuring 1x Cortex-X4 core at 3.4GHz, 3x Cortex-X4 core at 2.85GHz, and 4x Cortex-A720 efficiency cores at 2.0GHz. It also supports 18MB L3 + SLC cache, up to LPDDR5T @ 9600Mbps, and UFS 4.0 + MCQ storage.
Key features of Dimensity 9300+
Key features of Dimensity 9300+

If you will notice, the prime core of the new SoC is clocked higher at 3.4GHz versus 3.25GHz coming from its predecessor.

Dimensity 9300+ also has the 2nd generation thermal optimized design package design by MediaTek.

One of the main features of the chip is it has the MediaTek 790 APU with a 10 percent boost in AI performance. It also has support for the on-device LoRA Fusion and NeuroPilot LoRA Fusion 2.0 as well as ExecuTorch Delegation.

The GPU is the same Immortalis-G720 with 2nd generation hardware raytracing engine for smooth 60 FPS games and "console-grade" illumination effects.

For display, it uses the MediaTek MiraVision 990 with AI to support WQHD at 180Hz or 4K 120Hz displays. Of course, it has foldable support. It even has an anti-burn-in tech for AMOLED screens.

In the camera department, it uses the Imagiq 990 which features an 18-bit RAW ISP, AI videography, zero latency video preview, and more.

The chip also has WiFi 7 with Xtra Range support and sub-GHz AI 5G modem as well as  Bluetooth 5.4 with super low <35ms Bluetooth audio latency.

Dimensity 9300+ is also complete with 3x noise-cancelling mic support, GNSS, and hardware-level security.

There is no word on who will be the first to use it yet.

You may see the rest of its features in the source link below.

Source: MediaTek

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