HUAWEI targets 1.4nm equivalent chip density by 2031 using LogicFolding
It will debut its new LogicFolding architecture in the upcoming Kirin 2026 smartphone processor.
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| 1.4nm HUAWEI chips soon? |
Countering trade restrictions
HUAWEI is rolling out high-end chips amid efforts to counter US sanctions blocking China's access to advanced semiconductor manufacturing.
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| Image from HUAWEI |
According to the company, the chips will feature a transistor density that is equivalent to 14 Å (1.4 nm) processes. This will be implemented by 2031.
Based on HUAWEI's Tau (τ) Scaling Law, innovative LogicFolding technologies will be first implemented in the upcoming HUAWEI Kirin 2026, and subsequently help high-end HUAWEI chips achieve a groundbreaking transistor density equivalent to 14 Å (1.4 nm) processes by 2031, the company said.
A Reuters report quoted HUAWEI, noting that the Tau Scaling Law focuses on cutting the time it takes signals and data to move through chips and computing systems.
What Huawei is proposing is a shift from traditional node-driven scaling to system-level efficiency scaling, said He Hui, director of semiconductor research at Omdia.
The official said HUAWEI wants to focus on shortening interconnect, lowering latency, and improving data movement inside the chip, "which is a credible way to extract more performance when leading-edge lithography is constrained."
Aside from the Kirin smartphone chips, LogicFolding will also be applied to Ascend chips by 2030, as well as large AI clusters made up of hundreds or thousands of chips that power data centers.
HUAWEI said its chip division has designed and mass-produced 381 chips over the past six years based on the Tau Scaling Law for use in industries including smartphones and AI computing.
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