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Huawei files for semiconductor packaging patent to ease effects of US trade ban

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Huawei
To potentially ease the effects of the US trade ban, Huawei applied for a semiconductor packaging innovation patent.
Huawei files for semiconductor packaging patent to ease effects of US trade ban
File photo: Huawei store in China

Huawei semiconductor packaging innovation patent filed in China

According to reports, Huawei's patent application is for a type of chip stacking package and a terminal device to help solve the problem of high costs due to the use of through-silicon methods while meeting power supply requirements.

This development comes only days after Huawei's rotating chairman, Guo Ping, said at a press conference for the company's annual report that Huawei will deploy innovative semiconductor packaging technologies to assist it to deal with US trade restrictions.

Since the US trade ban was announced, Huawei has hurried to adjust its operations to further limitations set to take effect in 2020. As a recap, Huawei is banned access to chips that are designed or made using US technology from anywhere. If something has a US-made technology in it, Huawei can't utilize it.

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