Alleged realme Neo7 SE will feature Dimensity 8400 chip
Apart from POCO X7 Pro, an alleged realme Neo7 SE will also use the recently announced Dimensity 8400.
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| realme's teaser cropped |
realme's 1st phone in 2025?
realme showed a teaser photo with a mysterious phone bearing the new premium SoC. While the brand did not reveal what phone to expect, a renowned leaker Digital Chat Station claims it will be the realme Neo7 SE.
To recap, the latest chip was made for smartphones in the premium category. It boasts All Big Core Design which is the ARM Cortex-A725 comprising of eight cores.
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| A full teaser image of the alleged realme Neo7 SE |
The chip has up to 3.25GHz max boost clock which provides a 41 percent increase in multi-core compared to the previous version.
Furthermore, it has ARM Mali-G720 GPU providing 24 percent improved peak ability and 42 percent better power draw over the Dimensity 8300.
When it comes to, the chip uses the NPU 880 for accelerated Gen-AI tasks, while the new Dimensity Agentic AI Engine (DAE) transforms traditional AI applications into advanced agentic AI applications.
There's not much information about the upcoming device at the moment. Seeing that it could be the toned-down version of the Neo7, we might see a similar starship design and a large battery capacity just like its sibling.
What do you guys think?
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