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Blackview announces BL8000 rugged phone with MediaTek's 6nm Dimensity 1200 5G SoC

OPPO
Huawei
Hong Kong-based mobile maker Blackview recently announced the BL8000. It's the world's first rugged smartphone with MediaTek's new Dimensity 1200 SoC.
Blackview announces BL8000 rugged phone with MediaTek's 6nm Dimensity 1200 5G SoC
A 5G phone that you can use in the mountains?

BL8000 rugged phone with MediaTek's 6nm Dimensity 1200 5G chip!

To recap, the new Dimensity 1200 is a 6nm mobile chip boasting ARM's Cortex-A78 Ultra Core clocked at 3GHz, 3x 2.6GHz Cortex-A78 Super Cores, 4x 2.0GHz Cortex-A55 Efficiency Cores, nine-core Mali-G77 GPU, and an integrated global 5G modem with MediaTek's 5G UltraSave technology for better power efficiency.

Blackview also shared that the Dimensity 1200 will be paired with 12GB RAM and that's more than enough to ensure a smooth multitasking experience.

Other than that, the rest of the details are still unclear. The company just said that the phone "will fundamentally change the way we use the rugged phone" and "it will offer reliable connectivity and multi-touch boost touchscreen responsiveness."

Blackview also noted that this phone can be used on ski/snowboard slopes and in the mountains.

However, 5G in the mountains is likely non-existent unless you are on the summit of Everest.

What do you guys think?
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