Taiwanese chip giant MediaTek has just launched the new Dimensity 9200+, the upgrade of the Dimensity 9200 last year.
Basically, it now has an improved 1x ARM Cortex-X3 Ultra-Core with up to 3.35GHz clock speed, 3x up to 3.0GHz ARM Cortex-A715 Super-Cores, and 4x ARM Cortex-A1510 with up to 2.0GHz cores.
This is significantly higher than the 1x 3.05GHz ARM Cortex-X3 prime core, 3x 2.85GHz Cortex-A715 performance core, and 4x 1.8GHz Cortex-A510 power efficient cores of DImensity 9200.
Moreover, MTK overclocked its ARM Immortalis G715 GPU by 10 percent. It is 17 percent better in performance overall.
The chip is fabbed on the 2nd Gen TSMC 4nm-class with Optimized Packaging.
Moreover, the chip has the HyperEngine 6.0 tech to further improve the gaming experience with adaptive performance technology capable of sustaining high framerates and minimizing latency, Sixth generation AI Processing Unit (APU 690) to efficiently power AI-noise reduction and AI-super resolution tasks for real-time focus and bokeh adjustments and cinematic videos, and MediaTek Imagiq 890 ISP (image signal processor) for bright and sharp images and videos even in low light.
MediaTek also included the MediaTek MiraVision 890 with adaptive refresh rate technology and motion blur reduction as well as the MediaTek 5G UltraSave 3.0 to optimize battery life for all 5G connection conditions.
The new chip uses 4CC-CA 5G Release-16 modem that switches between long-reach sub-6GHz and super-fast mmWave connections. it also has Wi-Fi 7 2x2 + 2x2 with up to 6.5Gbps data rate and Bluetooth 5.3 LE that can connect at the same time with low latency without inference.
MediaTek said that smartphones powered by the Dimensity 9200+ are expected to be released in May 2023.
What do you guys think?
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